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Specification No. Date
SPECIFICATIONS
MODEL : LEUV-C31A
ROITHNER LASERTECHNIK VIENNA AUSTRIA www.roithner-laser.com office@roithner-laser.com Tel.: +43 1 586 52 43-0 Fax: +43 1 586 52 43 44
2001.Nov. 01 Optical Device Business Operation Components Division
UV-LED CHIP
MODEL : LEUV-C31A
APPLICANT Traced by Checked by Approved by
K.Song
B.H. Park
J.J. Jung
Optical Device Business Operation Components Division
No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written permission. Be careful never to exceed , even momentarily, the absolute maximum ratings specified in the data sheet. It will not be held responsible for any damage to the user that may result from accidents or any other reasons during operation of the user's unit if use to exceed the absolute maximum ratings, or not keep the matters that demand special attention.
Precautions for use Be sure to ground the worker's body and equipment when he or she handles the device. Do not drop the device or give any other mechanical shock. Set the electric potential of the work bench to the same as that of the power supply ground line. Store diodes in relative humidity of bellow 70%, and assure that the storage atmosphere is avoid of dust and gases harmful to diodes. Use a storage case which can not be easily charged with static electricity. This device is designed for general electric equipment. * Computer * Measuring instrument * OA equipment * Home appliances * AV equipment * Telecommunication equipment(Terminal) etc.
MODEL : LEUV-C31A
CONTENTS
1. Features
1/5 1/5
2. Outline dimensions
3. Chip's Physical structure
2/5
4. Absolute Maximum Rating
2/5
5. Electro-Optical characteristics
2/5
6. Reliability (Aging Test) 6-1 The Reliability criteria of LED Chip 6-2 Criteria for judging the damage
3/5
7. Packaging
4/5 5/5
8. Lot number
9. Others
5/5
MODEL PAGE
LEUVC31A 1/5
1. Features :
- High luminous intensity ; long operation life - Low current application ; low power consumption - Indoor / Outdoor applications - 100% Probing test - Excellent uniformity on wavelength and intensity
2. Outline Dimensions : (Unit:mm)
325 700 50
10
330
280
Cathode
110
100 Anode
110
375
700
50
Chip`s Pitch Shape Chip Pattern
Chip attach area ( Max. 100mm)
Blue sheet (Max. size) W250 x L250 50mm t : 0.2mm
10mm 10mm Label (W65 x L12)
MODEL PAGE
LEUVC31A 2/5
Chip's 3. Chip s Physical Structure :
Substrate Chip Characteristics Chip size Thickness Orientation Sapphire 0.375 x 0.330 80 20 0.5 cplane 0.03mm
(0001)
4. Absolute Maximum Rating
Parameter Forward Current Pulse Forward Current Reverse Voltage Power Dissipation Operating Temperature Storage Temperature
1) Pulse Width< 10msec, Duty< 1/10
1)
Symbol If Ifp Vr Pd Topr Tstg
Condition 30 100 5 120 30 - ~+ 80 40 - ~+ 100
Unit mA mA V mW
5. Electro-Optical Characteristics :
Parameter Forward Voltage Reverse current Dominant Wavelength Symbol Vf Ir Wp Condition If = 20mA Vr = 5.0 V If = 20mA 390 Min Typ
(Ta= 25 ) Max Unit 4.0 10 405 V A nm
Luminous Intensity (1)
Iv
A
If = 20mA
2.0
mW
(1) Luminous Intensity is measured by equipment on bare chip. However, the electrical and optical characteristics on lamps made from our chips is not guaranteed.
MODEL PAGE 6. Reliability (Aging Test) 6-1 The reliability criteria of LED chip
Operating condition Judgement of failure Room Temp., If=20mA, 48Hr Vf < Initial values Iop x 1.2 Ir < Initial values Iop x 1.2 Iv < Initial values Iop x 1.2
Ass'y Type : TO-18 Header, Without resin coating
LEUVC31A 3/5
6-2 Appearance check
We do appearance check for all chips, and we do not supply chips which will be out of specification according to inspection. 6.2.1 Check method : by 2 x 10 or 2 x 20 microscope. 6.2.2 Sampling size : 5chips/sheet. 6.2.3 Check items 6.2.4 Standard : appearance check of top side. : FQC inspection specification. Description ( Top side view ) Electrode damaged area 1/10 original electrode area. Figure or
Particle, dust, remnant area can not be larger than 1/20 emitting area. Chip crack damage, underlying damage area must be 25 diameter. p, n-electrode surface fineness must be uniform. Defect shape around the electrode width must be 1 mil. or
Contamination in chip can not be larger than 1/10 chip emitting area Bottom slip cutting can not be more than 1/10 original bottom area. Inclination of chip angle 30 Chip fall down 2ea / sheet Keep protection paper absolutely clean. Protection paper can not be damaged or scratched.
(side view)
MODEL PAGE 7. Packaging
LEUVC31A 4/5
The chips are packed in paper (5mm thick) boxes after packaging in anti-electrostatic polyethylene bag. According to the total delivery amount, cardboard and air vinyl boxes will be used to protected the wafers from mechanical shocks during transportation. Please refer to bellow figure. The label on the minimum packing unit bag shows ; model number, lot number and quantity with data. The boxes are not resistant and they must be keep away from water, moisture and dust. If a box shows noticeable damage upon arrival at the user's warehouse, it is recommended to make a notice within two weeks after arrival of the products.
Sheet box Chip sheet Sheet box (mm) W215 x L215 x H25
5
MODEL PAGE
LEUVC31A 5/5
8. Lot Number
The first six digits number shows lot number. The lot number is composed of the following character : Example :
:
: Kind of device ( BL for Blue LED, HR for Hyper RED ) Year ( M for 2000, M1 for 2001 ) : Month ( Ja for Jan., Se for Sep., Oc for Oct., No for Nov. ) : Product Number
9. Others
We cannot take any responsibility for any trouble that are caused by using the chips at conditions exceeding our specifications These chips are designed and manufactured for standard applications such as electric home appliances, communication equipment, office equipment, electronic equipment and so on. It is recommended to consult usin advance if user's application requires any particular quality or reliability which concerns human life. Examples would be medical equipment, aerospace applications, traffic signals, safety system equipment and so on.

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